发明名称 Method and system relating to thickness control of film vapor deposition
摘要 A method and system for determining a source flux modulation recipe for achieving a selected thickness profile of a film to be deposited (e.g., with highly uniform or highly accurate custom graded thickness) over a flat or curved substrate (such as concave or convex optics) by exposing the substrate to a vapor deposition source operated with time-varying flux distribution as a function of time. Preferably, the source is operated with time-varying power applied thereto during each sweep of the substrate to achieve the time-varying flux distribution as a function of time. Preferably, the method includes the steps of measuring the source flux distribution (using a test piece held stationary while exposed to the source with the source operated at each of a number of different applied power levels), calculating a set of predicted film thickness profiles, each film thickness profile assuming the measured flux distribution and a different one of a set of source flux modulation recipes, and determining from the predicted film thickness profiles a source flux modulation recipe which is adequate to achieve a predetermined thickness profile. Aspects of the invention include a computer-implemented method employing a graphical user interface to facilitate convenient selection of an optimal or nearly optimal source flux modulation recipe to achieve a desired thickness profile on a substrate. The method enables precise modulation of the deposition flux to which a substrate is exposed to provide a desired coating thickness distribution.
申请公布号 AU1940101(A) 申请公布日期 2001.06.12
申请号 AU20010019401 申请日期 2000.12.01
申请人 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, 发明人 CLAUDE MONTCALM;JAMES ALLEN FOLTA;CHRISTOPHER CHARLES WALTON
分类号 C23C14/54;G02B1/10 主分类号 C23C14/54
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