| 发明名称 |
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE |
| 摘要 |
An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask. <IMAGE> |
| 申请公布号 |
EP1107307(A1) |
申请公布日期 |
2001.06.13 |
| 申请号 |
EP20000935668 |
申请日期 |
2000.06.13 |
| 申请人 |
FUJIKURA LTD.;TEXAS INSTRUMENTS JAPAN LTD. |
发明人 |
SUZUKI, TAKANAO;INABA, MASATOSHI;OMINATO, TADANORI;KAIZU, MASAHIRO;KUROSAKA, AKIHITO;INABA, MASATOSHI;SADAKATA, NOBUYUKI;MASUMOTO, MUTSUMI;MASUMOTO, KENJI |
| 分类号 |
H01L21/56;H01L23/31;H01L23/485;H01L23/525 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
