| 发明名称 |
Soldering flux |
| 摘要 |
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form. |
| 申请公布号 |
AU1811601(A) |
申请公布日期 |
2001.06.12 |
| 申请号 |
AU20010018116 |
申请日期 |
2000.12.01 |
| 申请人 |
FRY'S METALS, INC. D/B/A ALPHA METALS, INC. |
发明人 |
SANYOGITA ARORA;ALVIN F SCHNEIDER;KAREN A. TELLEFSEN |
| 分类号 |
B23K1/00;B23K3/00;B23K35/36;B23K35/363;B23K101/42;H05K3/28;H05K3/34 |
主分类号 |
B23K1/00 |
| 代理机构 |
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