发明名称 CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a useful conductive film having flexibility, better and stable performances, and to provide its manufacturing method. SOLUTION: This porous polyamide film with a porous structure with fine nonlinear through-holes, porosity of 35 to 85%, hole diameter of 0.01 to 5 μm and film thickness of 5 to 50 μm, and has a overlapping structure of a fine porous layer and a layer with relatively large voids or openings in the cross-section of the film. On this porous polyamide film, in which the above two layers have mutually been connected via fine through-holes, an electroconductive polymer is made to retain.
申请公布号 JP2001160318(A) 申请公布日期 2001.06.12
申请号 JP19990346840 申请日期 1999.12.06
申请人 UBE IND LTD 发明人 FUKUNAGA KENJI;YAO SHIGERU;ASANO YUKIHIKO
分类号 G01N27/327;A61F2/08;A61L27/00;B32B5/18;B32B27/34;C08J9/28;H01B5/14;H01G4/18;H01G11/24;H01G11/26;H01G11/48;H01G11/66;H01M4/02;H01M4/137;H01M4/1399 主分类号 G01N27/327
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