METHOD AND APPARATUS FOR PICKING UP SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device picking up method and its apparatus which pick up next time a semiconductor device existing at a position being not affected by the deformation of a wafer sheet caused by thrusting up of the wafer sheet, to avoid influence on position recognition of a chip to be picked up next time by the deformation of the wafer sheet thrust up for picking up, when semiconductor chips stuck on the wafer sheet are picked up. SOLUTION: When diced semiconductor chips 2 on the wafer sheet 1 are picked up, semiconductor chips 2a which do not adjoin are picked up in order out of the diced semiconductor chips 2. A next semiconductor chip 2a is picked up, without being affected by the deformation of the wafer sheet 1 generated by the thrusting up of a semiconductor chip 2 when picked up last time.