| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for burying a thick-film passive part on an organic substrate, in which the flexible metallic substrate has a conductive paste under print thereon. SOLUTION: A method includes a step for applying the conductive paste under print on the flexible metallic substrate, a step for burning these members, a step for applying at least one layer of passive part paste on the under print, a step for burning these members, a step for bonding a passive-part face of the metallic substrate to at least one face of the organic layer coated at least partly with the adhesive layer. The method includes a step for burying the passive-part face of metallic substrate in the adhesive layer. |
