| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic wiring board which makes it possible that protrusions hardly grow; such protrusions may grow at portions of via conductors or regions around them on the multilayer ceramic wiring board obtained when a non-shrinking process is applied to manufacture the multilayer ceramic wiring board. SOLUTION: In a green composite laminate 18 which will be baked to form a multilayer ceramic board, a shrink-suppressing green layer 15 for suppressing the shrink in a main surface direction of a green sheet 12 for the base is made so that it is not formed on peripheral regions 16 of via conductors 14, and a conductive paste for the via conductor 14 is applied only within the thickness range of the green sheet 12 for the base. |
