发明名称 Apparatus for igniting a plasma in a plasma processing chamber
摘要 A method and apparatus to prevent charging of a substrate, retained by an electrostatic chuck in a plasma chamber, during ignition of a plasma. The method deactivates a voltage to the chuck electrodes (or other conductive element in a substrate support pedestal) and allows the chuck electrodes to float during ignition of the plasma. The method activates the chuck electrodes again following the ignition of the plasma.
申请公布号 US6246567(B1) 申请公布日期 2001.06.12
申请号 US19990468658 申请日期 1999.12.21
申请人 APPLIED MATERIALS, INC. 发明人 PARKHE VIJAY
分类号 H01J37/32;(IPC1-7):H02N13/00 主分类号 H01J37/32
代理机构 代理人
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