| 摘要 |
PROBLEM TO BE SOLVED: To form a protective film without deteriorating the surface characteristics of a base material. SOLUTION: Sputtering equipment 1 has a first anode having a base material to be subjected to film deposition, a cathode 10 provided in a manner to be opposed to the first anode, a target 11 provided on the cathode 10, and a second anode 12 provided between the first anode and the cathode 10. The second anode 12 is located in a position 10-33 mm apart from the principal plane of the target 11 facing the base material in a direction orthogonal to the principal plane and also 10-30 mm apart from the side face of the target 11 in a direction orthogonal to the side face.
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