发明名称 Layered dielectric on silicon carbide semiconductor structures
摘要 A dielectric structure is disclosed for silicon carbide-based semiconductor devices. In gated devices, the structure includes a layer of silicon carbide, a layer of silicon dioxide on the silicon carbide layer, a layer of another insulating material on the silicon dioxide layer, with the insulating material having a dielectric constant higher than the dielectric constant of silicon dioxide, and a gate contact to the insulating material. In other devices the dielectric structure forms an enhanced passivation layer or field insulator.
申请公布号 US6246076(B1) 申请公布日期 2001.06.12
申请号 US19980141795 申请日期 1998.08.28
申请人 CREE, INC. 发明人 LIPKIN LORI A.;PALMOUR JOHN WILLIAMS
分类号 H01L29/749;H01L21/02;H01L21/04;H01L21/28;H01L21/314;H01L21/329;H01L21/336;H01L21/338;H01L21/822;H01L27/04;H01L29/06;H01L29/12;H01L29/161;H01L29/24;H01L29/40;H01L29/51;H01L29/739;H01L29/78;H01L29/812;H01L29/861;H01L29/94;(IPC1-7):H01L31/031;H01L29/76;H01L23/58;H01L29/00 主分类号 H01L29/749
代理机构 代理人
主权项
地址