| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an inspection jig substrate device, that device, and an inspection method for a circuit board wherein a state, where electrode points corresponding to electrodes, which are to be inspected, of a substrate, which is to be inspected, are reasonably distributed across the less numbers of jig substrates, is easily and surely realized. SOLUTION: A proximate arrangement for proximal inspected electrodes among distributed/inspected electrodes arranged in such condition as exceeds a tolerant proximity arrangement D for an inspected jig substrate, which is to be manufactured, is assumed as M, related to an inspected substrate. Here, the number-of-jig-substrates decision process where the required numberαof inspected jig substrates is decided from the tolerant proximity arrangement D and the proximate arrangement M, and an electrode points distribution process where the electrode corresponding to the proximal inspected electrodes are distributed, at the tolerant proximity arrangement D or below, to a plurality of jig substrates, the number of which is decided by the previous process, are provided.
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