| 摘要 |
PROBLEM TO BE SOLVED: To efficiently and surely dissipate heat released from a heating part such as an IC, without increasing cost. SOLUTION: A chassis case 1 is mounted on a circuit board 11 mounted with an electronic circuit which includes a heat releasing part 12 such as an IC for the formation of an electronic equipment unit, where a heat sink 3 capable of coming into contact with the heat releasing part 12 is provided in the chassis case 1, and a tongue 4 is provided to at least the one side edge of the heat sink 3. On the other hand, an insertion hole 11a is provided to the circuit board 11 at a position corresponding to the tongue 4. The tongue 4 is inserted into the insertion hole 11a bored in the circuit board 11, by which the tongue 4 and the circuit board 11 are connected together, and then heat released from the heat releasing part 12 is dissipated through the chassis case 1 and the circuit board 11.
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