发明名称 Heat sink
摘要 A heat sink includes a thermally conductive body and at least one clip to secure the conductive body to a circuit board with a central processing unit interposed between the heat sink and the circuit board. The conductive body has a base with a flat bottom face positioned on the central processing unit and a top side on which a plurality of fins are formed. The fins are parallel with and spaced from each other to define slots therebetween which serve as air flow passages. The conductive body is made by means of extrusion whereby the fins and the base are integrated with each other as a unitary member. The clip has a U-shaped anchoring section fit into one of the slots and retained by the adjacent fins and a cantilevered arm extending from the anchoring section and having a free end. The free end has a hole for receiving a fastener to secure the clip to the circuit board. The clip is stamped to be a unitary member. Thus, the manufacture of the heat sink is greatly simplified.
申请公布号 US6246584(B1) 申请公布日期 2001.06.12
申请号 US19990293193 申请日期 1999.04.16
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 LEE HSIEH-KUN;LEE SHUN-JUNG
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
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