| 摘要 |
A flip-chip semiconductor device with generic bump patterns formed on a semiconductor substrate and having optimized electrical performance is provided. In a preferred embodiment, the flip-chip semiconductor device includes a semiconductor substrate on which active elements are formed and which has a surface having a plurality of peripheral portions, the active elements including Input/Output (I/O) circuitry and logic circuitry, a first power supply wiring and a first ground wiring disposed in the semiconductor substrate, a signal wiring disposed in the semiconductor substrate, and a first plurality of bumps arranged on the plurality of peripheral portions and selectively used for coupling the semiconductor substrate to a second substrate. The first plurality of bumps are arranged in a matrix pattern of 6 rows by n columns. Bumps in predetermined locations in the matrix are selectively coupled to the first power supply wiring and the first ground wiring. |
