| 摘要 |
PROBLEM TO BE SOLVED: To obtain a spherical inorganic powder having characteristics of low thermal expansibility, high fracture toughness, high bending strength, solder reflow resistance and low abrasion resistance of a metal mold and capable of remarkably improving the fluidity of an encapsulant regardless of the kind of an epoxy resin even in a high filling region of a filler and a resin composition for sealing a semiconductor. SOLUTION: This spherical inorganic powder is characterized as having the maximum values in a region of 20-70μm, a region of 3.0-10μm and a region of 0.20-1.0μm in a frequency particle size distribution. The resin composition for sealing the semiconductor is characterized as comprising the epoxy resin, a curing agent for the epoxy resin and the above spherical inorganic powder.
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