| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting semiconductor device of which the stable bonding property can be obtained by realizing compactness. SOLUTION: This semiconductor device is provided with an electrode pad portion 18 at the tip of an inner lead 14 of a lead frame 19 and has the structure in which this electrode pad portion 18 is connected using an electrode pad 17 of a semiconductor element 11 and a wire 12. |
