| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board together with its manufacturing method wherein IVH is packed by plating which is excellent in environment and deposition speed. SOLUTION: An insulating layer, a circuit conductor provided on the surface of insulating layer, and an IVH filled with electroless nickel plating or electroless nickel-alloy plating for connection between circuit conductors provided in different layers, are provided. The insulating layer is provided on an inner-layer circuit board comprising an inner-layer conductor, and the insulating layer is provided with a hole reaching the inner-layer conductor, and further, the hole is filled with electroless plated nickel or electroless plated nickel-alloy. |
