发明名称 COOLING STRUCTURE OF ELECTRONIC EQUIPMENT AND ITS COOLING SYSTEM
摘要 PROBLEM TO BE SOLVED: To simultaneously efficiently radiate the heat from a heat generating component in a module with small heat resistance and be attach and detach in a plug-in unit. SOLUTION: In the electronic equipment 1, the heat generated 6 in a panel- like flat heat pipe module 2 is transferred to a heat absorbing plate 4 by plug-in mounting through a flat surface 7 form the heat pipe. The surface 7 is pressed in a thickness direction by the contact of the part 3 and an elastic element, and the site 7 is in surface contact with the plate 4 of the radiator 5 by pressure. Since the contact area of the surface 7 with the late 4 is large, its contact thermal resistance is reduced. The heat transferred to the plate 4 is transported to the radiator 5, and heat exchanged with the atmosphere responsive to applications such as natural air cooling, forcible air cooling, liquid cooling or the like through the radiator 5.
申请公布号 JP2001156483(A) 申请公布日期 2001.06.08
申请号 JP19990332912 申请日期 1999.11.24
申请人 NEC NETWORK SENSA KK 发明人 FURUTA SHIGEKI
分类号 H05K7/20;H01L23/427;(IPC1-7):H05K7/20 主分类号 H05K7/20
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