| 摘要 |
PROBLEM TO BE SOLVED: To develop a mass-production technique on a continuous line and inexpensively producing a substrate for a semiconductor package, which can be used for the demand of complicated and a delicate product field and further can be used for the other fields as well in spite of a special structure/ performance and not-inexpensive production cost even in mass-production be cause of a lot of processes and low yield although the high-quality product of an extremely complicated and delicate pattern can be provided in a produc tion process for opening a lot of holes on a double-sided board, performing plating later, forming a through-hole and forming a circuit pattern later, for example, for meeting the demand for lightening in weight, thinning, shortening and miniaturizing and dealing with that demand by performing thinning, multilayering and density improving when producing a printed circuit board. SOLUTION: Concerning the substrate for semiconductor package and a producing method therefor, single-sided printed wiring boards are folded, mutually adhered on the backs thereof and conducted from a fixed part to a terminal part by a lead wire on the substrate without using through-holes.
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