SEMICONDUCTOR PRESSURE SENSOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent air bubbles from appearing in the protective member by chemicals and water content in the environment in a semiconductor pressure sensor device having a sensor chip and parts which are electrically connected to the sensor chip and covered and protected with the protective member. SOLUTION: The sensor device 100 is constituted such that the pressure detecting semiconductor sensor chip 2 is mounted in a resin package 1 having insert-formed conductive material-made insert pins 4 and electrically connected to the pins 4 through bonding wires 6, and the pins 4 and the wires 6 are covered and protected with a protective member 7 made of-an electrically insulative and flexible fluororesin gel. The protective member 7 has a saturation swelling percentage of 7 wt.% or less when dipped in gasoline at 20 deg.C.