| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate, with which miniaturization is enabled and grounding is satisfactory as well. SOLUTION: A ceramic mltilayer substrate 10 is provided with four green sheets 111-114, a via hole conductor 12 is formed at a prescribed position on each of green sheets 111-114, a die bond pad 14 and a wire bond pad 15 are formed on the surface of the green sheet 111 and an internal electrode 13 is respectively formed on the surface of each of green sheets 112-114. Then, the green sheets 111-114 are laminated, thermally press-fixed and burnt later and the back side is printed with conductor paste mainly composed of copper so that an external electrode 19 is formed. Afterwards, a semiconductor device 16 is mounted on the die bond pad 14 and between each of electrodes 17 and a wire bond pad 15, the semiconductor device 16 performs wire bonding wire a metal wire 18.</p> |
