| 摘要 |
<p>PROBLEM TO BE SOLVED: To quickly and electrically and mechanically reliably provide a method of mounting a semiconductor chip on a wiring board at a low cost, in a mountable flip-chip connection system. SOLUTION: This mounting method comprises a step of pressing bumps of a semiconductor bare chip onto a thermoplastic resin film which is in a molten state in the condition of heating the thermoplastic resin film covering electrode regions on a wiring pattern with application of ultrasonic waves, thereby pushing the molten thermoplastic resin film aside to cause the bumps to contact the electrode regions, a step of successively applying ultrasonic waves to ultrasonically bond the bumps to the electrode regions in the condition of the bumps contacted to the electrode regions, and a step of cooling and hardening the molten thermoplastic resin to adhere the semiconductor bare chip to the wiring board.</p> |
