| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a tape-sticking apparatus by with which an adhesive tape can be used without waste, to improve the yield and the sticking performance between the adhesive tape and a substrate can be improved. SOLUTION: A tape-sticking apparatus, with which only the adhesive tape 10 of a long tape material 2 composed of the adhesive tape 10 and a pasteboard 9, on which the adhesive tape 10 is stacked, is cut into a prescribed length and stuck to a wafer ring 85 and the substrate 73 has a pressing unit 7, which is placed on a sticking stage 5 and presses the adhesive tape 10 stuck to the wafer ring 85 and the substrate 73 to be stuck tightly.</p> |
