SEMICONDUCTOR MICRO-VALVE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor micro-valve obtaining sufficient heat insulating performance. SOLUTION: A fillet part 8 consisting of organic material is formed in a location (location of so-called internal angle) astride a flexible part 3 and a frame part 5 in the vicinity of a heat insulating region 4, a power supplying wire 7 is formed in this fillet part 8. Since a heat insulation distance of the power supplying wire 8 can be increased as compared with the conventional example by forming the power supplying wire 7 in the fillet part 8, a decrease of heat resistance (heat insulating performance) in the heat insulating region 4 can be prevented, sufficient heat insulating performance is obtained.