| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA-type wiring tape and a BGA-type semiconductor device, where tin contained in a solder ball does not elute to the cleaning liquid of a flux. SOLUTION: Continuity between solder ball lands 9a, 9b and a carrier frame 13 is interrupted by forming an interruptor 16 in a routing wiring 7b, which connects the solder ball lands 9a, 9b and a plating power supply lead 15. The interrupt of continuity prevents the battery effect between a solder ball 11 on the solder ball lands 9a, 9b and the carrier frame 13 of iron or the like during flux cleaning after the solder ball 11 is formed, so that tin is prevented from eluting out of the solder ball 11 into the cleaning liquid.
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