| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board together with its manufacturing method wherein a current stably flows even when an operation frequency or electric-power quantity increases by suppressing fluctuation in tolerable current regardless of form, oxidized state, etc., of wiring comprising a conductor circuit. SOLUTION: A build-up wiring layer is provided wherein an upper-layer conductor circuit is electrically insulated from a lower-layer conductor circuit with an inter-layer resin insulating layer, while they are electrically connected through many via holes. Here, among the many via holes 10 and 20, at least a part of via holes is provided with a resistor 6. The resistor is provided in the via hole by selectively masking a part of many openings while the surface of inter-layer resin insulating layer comprising an opening which is not masked is electroless-plated or sputtered.</p> |
