| 摘要 |
PROBLEM TO BE SOLVED: To simply measure the absolute film thickness distribution of a thin film formed on a wafer or the like in a short time. SOLUTION: A relative film thickness distribution of the whole thin film on the wafer is obtained from light interference fringes, absolute values of film thickness of two or more thin film portions different in film thickness in the relative film thickness distribution are measured, and the absolute film thickness distribution of the whole thin film is obtained from the relative change amount of film thickness from the absolute values.
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