| 摘要 |
PROBLEM TO BE SOLVED: To obtain a means that enhances the increase in the bandwidth and the attenuation in the vicinity of the pass band f a flip chip ladder type surface acoustic wave filter. SOLUTION: In the flip chip ladder type surface acoustic wave filer where surface acoustic wave resonators are alternately arranged as a parallel arm, a series arm and a parallel arm on a major side of a piezoelectric substrate, a lead electrode of the parallel arm toward the ground side is connected to the ground via one pad electrode.
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