| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type semiconductor laser device, in which material cost and manufacturing cost can be reduced and which can also be mounted on a surface. SOLUTION: A discoid resin stem 2 is installed onto a resin base 1 having an approximately rectangular plane, a semiconductor laser element 3 and a P-I-N photo diode element 4 are loaded on the resin stem 2, and one end of the first lead terminal 8a connected to the semiconductor laser element 3 and one end of the second lead terminal 8b connected to a P-I-N photo diode element 4 are projected from the top face of the resin stem 2, while the other ends of the first and second lead terminals 8a, 8b are projected from the side face of the resin base 1, thus constituting the chip type semiconductor laser device.
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