| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric device which can be improved favorably in soldering property. SOLUTION: The thermoelectric device is provided with thermoelectric elements 1 containing a thermoelectric material as a main ingredient, substrates 21 and 22 respectively having electrode layers 25 for feeding the elements 1 with electricity, and first solder layers 51 which are interposed between the thermoelectric elements 1 and electrode layers 25 so as to join the elements 1 to the layers 25. The device is also provided with conductive intermediate metallic layers 31 which are interposed between the electrode layers 25 and first solder layers 51. Upon the surfaces of the metallic layers 31 facing the first solder layers 51, plated-gold layers 41 are laminated.
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