| 摘要 |
PROBLEM TO BE SOLVED: To provide a tag sealing method free from damages upon a semiconductor chip and a metallic thin wire in a laminate even when temperature rises unanticipatingly and large pressure is applied suddenly. SOLUTION: A tag has an antenna circuit 2 and a semiconductor chip 3 on a substrate 1. For sealing the tag,. a protective sheet 5 is covered on the antenna circuit 2 and the semiconductor chip 3 mounted on the substrate 1. A molten resin 9 is injected from a resin inlet 6 by means of the resin inlet 6 bored in the protective sheet 5 after/before covering the sheet and the tag is sealed while discharging air from the exhaust port 7.
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