PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having both good heat resistance and low stress and also having good characteristics as the material of a stress relieving layer, a method for producing a pattern and electronic parts excellent in reliability. SOLUTION: The photosensitive resin composition contains a polyimide precursor. The transmittance of a film formed from the precursor to light of 365 nm wavelength per 10 μm thickness is >=1% and a polyimide obtained by the ring closure of the polyimide precursor has an α2 to α1 ratio of 1-50 between the coefficient of thermal expansion (α1) of the polyimide at a temperature lower than its glass transition temperature and the coefficient of thermal expansion (α2) of the polyimide at a temperature higher than its glass transition temperature.