| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent particles formed by the separation of a thin film, deposited on a substrate holder from adhering to a substrate. SOLUTION: A film-removing chamber 70 is connected airtightly to an unload lock chamber 2, in which the substrates 9 on which films have been formed are unloaded from the substrate holder 90 and a load lock chamber 1, in which the substrates 9 on which films have not been formed are loaded on the substrate holder 90 in a return transfer route between the unload lock chamber 2 and the load lock chamber 1. A film-removing mechanism, which removes the thin film deposited on the substrate holder 90 by sputtering etching using ion impact is provided in the film-removing chamber 70.</p> |
