METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board of small size. SOLUTION: A resin layer 4 is provided on the surface of a ceramic board 1, a groove 5 having a prescribed pattern is provided to the resin layer 4, then the groove 5 is filled with conductive paste 6, the conductive paste 6 is cured, and the resin layer 4 is removed.