| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED chip mounting method capable of reducing the defectrate. SOLUTION: The LED chip mounting method is constituted of a first process S10 for applying an adhesive agent to a portion inside a cup of a lead frame (a base free from recess) or on a printed circuit board, a second process (S20) for promoting viscosity of the adhesive agent by means of ultraviolet irradiation or heating to the adhesive agent, a third process (S30) for mounting an LED chip on the adhesive agent, and a fourth process (S40) for completely curing the adhesive agent by means of the ultraviolet irradiation or the heating. The viscosity of the adhesive agent is sufficiently lower than that of Ag paste, and can be provided to the same level as the Ag paste by means of the ultraviolet irradiation and the heating. Further, the agent can be completely cured by the ultraviolet irradiation and the heating. |
