SEMICONDUCTOR CHIP, MULTI-CHIP PACKAGE AND SEMICONDUCTOR DEVICE AS WELL AS ELECTRONIC EQUIPMENT USING IT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip module, a multi-chip package and a semiconductor device as well as an electronic equipment using it capable of easily three-dimensionally mounting semiconductor chips, minimizing deterioration of electric characteristics and being easily manufactured with a small profile size. SOLUTION: The electrode positions of the semiconductor chips are etched to form a groove of a V shape or a pyramidal shape. The groove is cut and divided, electrodes are formed on the oblique parts of the groove of the divided chips and the end faces of the chips are substantially linearly aligned.