发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device after it is mounted on a mounted substrate. SOLUTION: In this semiconductor device, a pad rearrangement layer where an electrode pad is rearranged on one face of the semiconductor substrate and a program element changing circuit constitution. The program element has antifuse structure, where wirings are electrically connected by electrical breakdown.</p> |
申请公布号 |
JP2001156172(A) |
申请公布日期 |
2001.06.08 |
申请号 |
JP19990332807 |
申请日期 |
1999.11.24 |
申请人 |
HITACHI LTD;HITACHI ULSI SYSTEMS CO LTD |
发明人 |
HARA YUJI;YONETANI TOUTA;TAKAHASHI SHINO |
分类号 |
H01L23/12;H01L21/82;H01L21/822;H01L27/04;(IPC1-7):H01L21/82 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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