PACKAGING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a packaging method for a semiconductor device for providing a function, which can not be provided with a single resin, such as improvement in both characteristics of humidity resistance and corrosion resistance. SOLUTION: Concerning the packaging method for a semiconductor device 1 sealed with at least two kinds of thermosetting sealing agents 5 and 6, after the semiconductor device 1 is sealed using the corrosion resistant sealing agent 5, the device is sealed with the humidity resistant sealing agent 6 so as to cover the outside of the said corrosion resistant sealing agent 5.