| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing methods of a lead plating machine and a semiconductor device, which can avoid defective mounting caused by attach ment of plated metal dust to any external lead of a semiconductor device when cutting and forming the end of each external lead and can stably give uniform plating to the surface of each external lead of a semiconductor device. SOLUTION: This plating machine has a tank 3, in which a semiconductor device 10 is placed, a tray (negative plate) 1 equipped with a projection 1a making contact with an external lead 2 of the semiconductor device 10, and a top cover 2 equipped with a projection 2a catching and securing the external lead 12 of the semiconductor device 10 placed on the tray (negative plate) 1. The plating machine catches a flat portion 12c of the formed external lead 12 of the semiconductor device 10, which was separated into a discrete chip, and gives plating to the external lead 12. |
