| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device having no cutout fragments of a sealing resin or no chipping or the like by reducing metal burr in the step of cutting from a lead frame and a method for manufacturing it. SOLUTION: A wedge-like protrusion is formed in a mold for resin-sealing a semiconductor element 120, a die pad 111 for mounting the element 120 and an electrode terminal 113. Thus, a continuous groove is formed at the terminal 13 and a sealing resin 150 therebetween. Then, the terminal 113 is cut at the groove and separated from the lead frame. A step 171 is formed on the outer periphery of the semiconductor device 170, and a chamferred part 155a caused by the groove is formed on its upper end. Since the terminal is cut at the groove, its sectional area can be reduced, and burr, chipping, cutout fragments or the like by cutting can be suppressed.
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