发明名称 THERMOELECTRIC MODULAR REFRIGERATOR
摘要 PROBLEM TO BE SOLVED: To obtain a thermoelectric modular refrigerator in which cost is reduced while enhancing reliability by simplifying the structure of the connecting piping of a cooling system. SOLUTION: Soft connecting pipes 27, 34, 35 connecting a manifold 21c, a chamber 24 and a radiation heat exchanger 22 are integrally molded two- dimensionally or three-dimensionally. Labor and cost of piping are reduced by connecting the delivery pipe 23 of the manifold 21c with the suction pipe 25 of the chamber 24, the delivery pipe 26 of the chamber 24 with the suction pipe 31 of the radiation heat exchanger 22, and the delivery pipe 32 of the radiation heat exchanger with the suction pipe 30 of the manifold 21c, and reliability is enhanced by decreasing the joints.
申请公布号 JP2001153521(A) 申请公布日期 2001.06.08
申请号 JP19990333780 申请日期 1999.11.25
申请人 MATSUSHITA REFRIG CO LTD 发明人 ASAKURA YOSHIAKI;KUWAJIMA KATSUYUKI;NAKAGAWA OSAMU;KAWASAKI SEIICHI;TAKABAYASHI SHIZUO
分类号 F25D17/02;F25D11/00;(IPC1-7):F25D11/00 主分类号 F25D17/02
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