| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which no unsoldered part is produced during remounting CSP/BGA. SOLUTION: This method includes a step (d) for supplying a highly active flux 5 to the inside of a dam block 4 and heating it with a heater 6 provided under a wiring board 1; a step (e) for removing the dam block 4, cleaning and removing the remaining flux 5, applying a low active flux to the area of the wiring board 1 where a BGA (or CSP) is remounted, and remounting a non- defective BGA (or CSP) 2b; and a step (f) for bonding the wiring board 1 and non-defective BGA (or CSP) 2b by reflow.
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