| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of difficulty in matching characteristic impedance by arranging a desired through-conductor for grounding, on a through-conductor for a signal in a multilayered substrate having a parallel wiring group. SOLUTION: A second insulating layer I2, having a second parallel wiring group L2 orthogonally crossing a first parallel wiring group L1, is laminated on a first insulating layer I1 having a first parallel wiring group L1, and the first and second parallel wiring group L1 and L2 are connected by a through- conductor group T. The first and second parallel wiring groups L1 and L2 are respectively provided with signal wirings S1 and S2 and power source wiring P1 and P2 or ground wiring G1 and G2 adjacent to the signal wiring S1 and S2, and an auxiliary through-conductor Ts whose one end is connected with the power source wiring P1 and P2 or the group wiring G1 and G2 adjacent to the through-conductor T1 for a signal for connecting the signal wiring S1 and S2, and whose other edge is opened is arranged between the first and second parallel wiring groups L1 and L2.
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