发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To etch an aluminum oxide and a silicon oxide film formed thereon with the same etchant in accordance with selectivity to a wiring made of an aluminum film. SOLUTION: Using the same etchant containing ethylene glycol added 16-30 vol% (preferably 20-22 vol%) to a buffered hydrofluoric acid water solution, the aluminum oxide and the silicon oxide film formed thereon are etched in accordance with selectivity to the wiring made from the aluminum film. Thus, a good electric conduction of the wiring made from the aluminum film to other wirings is ensured.
申请公布号 JP2001156054(A) 申请公布日期 2001.06.08
申请号 JP19990338752 申请日期 1999.11.29
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NAKAZAWA MISAKO;OTANI HISASHI
分类号 H01L21/3213;H01L21/306;H01L21/308;H01L21/336;H01L29/786;(IPC1-7):H01L21/308 主分类号 H01L21/3213
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