发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To etch an aluminum oxide and a silicon oxide film formed thereon with the same etchant in accordance with selectivity to a wiring made of an aluminum film. SOLUTION: Using the same etchant containing ethylene glycol added 16-30 vol% (preferably 20-22 vol%) to a buffered hydrofluoric acid water solution, the aluminum oxide and the silicon oxide film formed thereon are etched in accordance with selectivity to the wiring made from the aluminum film. Thus, a good electric conduction of the wiring made from the aluminum film to other wirings is ensured.
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申请公布号 |
JP2001156054(A) |
申请公布日期 |
2001.06.08 |
申请号 |
JP19990338752 |
申请日期 |
1999.11.29 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
NAKAZAWA MISAKO;OTANI HISASHI |
分类号 |
H01L21/3213;H01L21/306;H01L21/308;H01L21/336;H01L29/786;(IPC1-7):H01L21/308 |
主分类号 |
H01L21/3213 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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