| 摘要 |
PROBLEM TO BE SOLVED: To accurately position the mounting position of electronic parts without losing the soldering property of a lead. SOLUTION: When through holes 21a-21n are to be arranged at the mounting position of electronic parts 10 with a plurality of leads 1 2a-12n being arranged at a specific pitch, the diameter of each of the through holes 21a-21n is set to the same value, the remaining through holes 21b-21n-1 are arranged at the same pitch as the leads 12b-12n-1 excluding the two specific through holes 21 a and 21n, and at the same time each position is shifted to opposite sides, namely in a direction where they are separated each other or they approach each other so that the leads 12a and 12n being inserted into the specific through hole essentially come into contact with the inner wall surface for the two specific through holes 21a and 21n.
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