发明名称 PATTERN FOR INSPECTING CONNECTION BETWEEN CIRCUIT BOARDS
摘要 PROBLEM TO BE SOLVED: To electrically and securely inspect deviation between terminals that cannot be inspected by viewing when electrically connecting two circuit boards while holding an anisotropic conductive film. SOLUTION: A first inspection pattern 210 is provided at one circuit substrate side, and a second inspection pattern 120 is provided at the other circuit substrate side. The first inspection pattern 210 is set to three connection verification electrodes 211-213 that are arranged at an equal pitch with a group of connection electrode terminals 10 and 20, and the connection verification electrodes 211 and 213 being located at both the left and right ends are connected by a connection wiring pattern 214. The second inspection pattern 120 corresponds to the connection verification electrodes 211-213 in terms of position, which are electrically independent as three measurement electrodes 121-123 being formed in a stripe shape. As a result, after the two circuit boards are connected by an anisotropic conductive film, it can be inspected whether connection resistance is conforming or not according to the resistance between the measurement electrodes 121 and 123, and it can be inspected whether the insulation resistance between terminals is conforming or not according to each resistance between the measurement electrodes 121 and 122 and between the measurement electrodes 122 and 123.
申请公布号 JP2001156417(A) 申请公布日期 2001.06.08
申请号 JP19990339452 申请日期 1999.11.30
申请人 OPTREX CORP;HIROSHIMA OPT KK 发明人 TOKUNAGA SHOZO
分类号 H05K1/11;G02F1/1345;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K1/11
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