| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system of mounting solder balls by which damages to solder balls can be prevented, the manufacturing costs can be reduced and mounting of solder balls on a member to be equipped can be performed in a short time and with reliability. SOLUTION: The method of mounting solder balls consists of sucking a plurality of solder balls 9 to suction openings 11 for maintaining them in specified positions, and mounting them on a member 10 to be equipped which is placed under them. The solder balls 9 are mounted on the member 10 by blowing the solder balls 9 from the suction openings 11 and protruding the solder balls 9 remaining on the suction openings 11 after blowing by protruding members 26. When the solder balls 9 are blown from the suction openings 11 toward the member 10, it is preferable that solder balls 9 are blown through a half number of the suction openings 11 toward the member 10 first and then the solder balls 9 are blown toward the member 10 through the rest half of the suction openings 11.
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