发明名称 MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of ceramic electronic components where the warpage of the support plates as a whole is suppressed and they can be laminated accurately. SOLUTION: This manufacturing method of the ceramic electronic parts of laminated ceramic capacitors comprises a process for creating inner-electrode fitted ceramic sheets each of which has an inner electrode on its surface, a process for providing penetrated slits 13 in a support plate 10 near the corner portions of outer peripheral portion of a laminated body block 12 to be formed subsequently, a process for forming a mold releasing layer 11 on the portion of one surface of the support plate 10 which is surrounded by the slits 13, a process for laminating ceramic sheets on the mold releasing layer 11 and thereafter so laminating the inner-electrode fitted ceramic sheets thereon so as to produce the laminated body block 12, a process for so dividing cuttingly on the support plate 10 the laminated body block 12 into desired shaped laminated bodies that the individual laminated bodies are separated from each other, by peeling them from the support plate 10, a process for obtaining thereafter sintered bodies by baking the individual laminated bodies, and a process for forming external electrodes on the end-faces of each sintered body of each laminated capacitor, whereon inner electrodes 2 are exposed.
申请公布号 JP2001155960(A) 申请公布日期 2001.06.08
申请号 JP19990335924 申请日期 1999.11.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIURA KATSUYUKI;TAKAHASHI TATSUO;SAKAGUCHI YOSHIYA
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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