| 摘要 |
The semiconductor device comprises a coating box (21) containing a connecting grid (2) with a central plate (3) to receive a chip (1) forming an integrated circuit. The central plate has a series of connecting lugs (5) projecting outside the box and inner connecting wires (9, 10, 11), at least some of which have ends soldered to the central plate. The central plate has a series of peripheral through passages (7), located more or less in line with the connecting lugs while the ends of the connecting wires (12, 13) welded to the central plate are situated adjacent to at least some of the through passages or in between them. |
