发明名称 HIGH FREQUENCY MODULE
摘要 PROBLEM TO BE SOLVED: To provide a high frequency module that can avoid impedance mismatching caused by a parasitic element in the case of interconnecting an integrated circuit and a board, reduce reflection at a connection point of signal power and transmit the signal power with a sufficient level. SOLUTION: A termination impedance circuit that utilizes an emitter impedance Z1 of a transistor(TR) Q1 to easily generate a variable inductive reactance thereby outputting a series impedance ZT consisting of a resistor and an inductor, consists of the TR Q1, resistors P1, R3, and constant current sources I1, I2 and placed to input output terminals in an integrated circuit in the high frequency module connected to a transmission line by a bonding wire or the like. Thus, impedance mismatch in the high frequency module can be avoided and a signal with small output power can be transmitted up to a desired integrated circuit.
申请公布号 JP2001156617(A) 申请公布日期 2001.06.08
申请号 JP19990334988 申请日期 1999.11.25
申请人 HITACHI LTD 发明人 MASUDA TORU
分类号 H01L23/12;H03H7/38;H03K19/0175;(IPC1-7):H03K19/017 主分类号 H01L23/12
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